Inventor
HSU HUAI-JEN
TW3 patents
Patents
3 patentsUS6709965B1Mar 23, 2004
Aluminum-copper bond pad design and method of fabrication
TAIWAN SEMICONDUCTOR MFG35 citations86
US6677228B1Jan 13, 2004
Reinforced aluminum copper bonding pad
TAIWAN SEMICONDUCTOR MFG16 citations77
US6927345B2Aug 9, 2005
Guard ring having electrically isolated lightening bars
TAIWAN SEMICONDUCTOR MFG10 citations68