Inventor

RO YOUNGHOON

KR6 patents

⚠️ This page may combine multiple inventors who share the name “RO YOUNGHOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

2 patents

US9018041B2Apr 28, 2015

Package for semiconductor device including guide rings and manufacturing method of the same

SAMSUNG ELECTRONICS CO LTD1 citations51

US11373942B2Jun 28, 2022

Semiconductor devices

SAMSUNG ELECTRONICS CO LTD0 citations43

SONG EUN-SEOK

1 patent

US8143713B2Mar 27, 2012

Chip-on-board package

SONG EUN-SEOK9 citations81

O IN WON

1 patent

US8823185B2Sep 2, 2014

Semiconductor packages

O IN WON9 citations75

YOUN HANSHIN

1 patent

US8587108B2Nov 19, 2013

Package for semiconductor device including guide rings and manufacturing method of the same

YOUN HANSHIN2 citations54

RO YOUNGHOON

1 patent

US9418914B2Aug 16, 2016

Package substrates, semiconductor packages having the package substrates

RO YOUNGHOON0 citations44