Inventor
CHO YONGHOE
KR13 patents
Patents
13 patentsUS11862596B2Jan 2, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD5 citations73
US10748953B2Aug 18, 2020
Methods of forming redistribution lines and methods of manufacturing semiconductor devices using the same
SAMSUNG ELECTRONICS CO LTD2 citations72
US11552037B2Jan 10, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD3 citations71
US11824076B2Nov 21, 2023
Semiconductor package including an image sensor chip and a method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11335719B2May 17, 2022
Semiconductor package including an image sensor chip and a method of fabricating the same
SAMSUNG ELECTRONICS CO LTD1 citations61
US11869818B2Jan 9, 2024
Chip-stacked semiconductor package and method of manufacturing same
SAMSUNG ELECTRONICS CO LTD0 citations60
US11328966B2May 10, 2022
Chip-stacked semiconductor package and method of manufacturing same
SAMSUNG ELECTRONICS CO LTD0 citations60
US12431474B2Sep 30, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations51
US11776941B2Oct 3, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations51
US10615213B2Apr 7, 2020
Methods of forming redistribution lines and methods of manufacturing semiconductor devices using the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US11244894B2Feb 8, 2022
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD0 citations50
US12439715B2Oct 7, 2025
Image sensor package and system having the same
SAMSUNG ELECTRONICS CO LTD0 citations47
US10636760B2Apr 28, 2020
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD0 citations40