Inventor
YEON SEUNGHOON
KR16 patents
Patents
16 patentsUS11862596B2Jan 2, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD5 citations73
US10748953B2Aug 18, 2020
Methods of forming redistribution lines and methods of manufacturing semiconductor devices using the same
SAMSUNG ELECTRONICS CO LTD2 citations72
US11552037B2Jan 10, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD3 citations71
US11569201B2Jan 31, 2023
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11158603B2Oct 26, 2021
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11990452B2May 21, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US11887913B2Jan 30, 2024
Integrated circuit device and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11626385B2Apr 11, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US11545512B2Jan 3, 2023
Image sensor package with underfill and image sensor module including the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11545417B2Jan 3, 2023
Integrated circuit device and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD1 citations61
US11869818B2Jan 9, 2024
Chip-stacked semiconductor package and method of manufacturing same
SAMSUNG ELECTRONICS CO LTD0 citations60
US11328966B2May 10, 2022
Chip-stacked semiconductor package and method of manufacturing same
SAMSUNG ELECTRONICS CO LTD0 citations60
US11942446B2Mar 26, 2024
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US10615213B2Apr 7, 2020
Methods of forming redistribution lines and methods of manufacturing semiconductor devices using the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US11244894B2Feb 8, 2022
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD0 citations50
US10636760B2Apr 28, 2020
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD0 citations40