Inventor
LEE KYUNG WOOK
KR17 patents
⚠️ This page may combine multiple inventors who share the name “LEE KYUNG WOOK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMWON ACT CO LTD
8 patentsUSD902445SNov 17, 2020
Connection bracket of building interior material
SAMWON ACT CO LTD7 citations82
US11319711B2May 3, 2022
Metal interior material and interior material attachment structure
SAMWON ACT CO LTD2 citations71
USD903153SNov 24, 2020
Building interior material
SAMWON ACT CO LTD5 citations71
US12345050B2Jul 1, 2025
System wall for building interior
SAMWON ACT CO LTD0 citations60
US12155189B2Nov 26, 2024
Wirable bracket and module coupling device coupled thereto
SAMWON ACT CO LTD0 citations60
US12006698B2Jun 11, 2024
Metal material to which flammable thin-film construction interior material is adhered, and attachment structure for attaching same
SAMWON ACT CO LTD0 citations60
US11840844B2Dec 12, 2023
Unit bracket, bracket and bracket construction method for attaching to base material and wall using the same
SAMWON ACT CO LTD0 citations57
US11291123B2Mar 29, 2022
Circuit board
SAMWON ACT CO LTD0 citations44
SAMSUNG ELECTRONICS CO LTD
6 patentsUS7642140B2Jan 5, 2010
CMOS integrated circuit devices and substrates having buried silicon germanium layers therein and method of forming same
SAMSUNG ELECTRONICS CO LTD135 citations99
US6633066B1Oct 14, 2003
CMOS integrated circuit devices and substrates having unstrained silicon active layers
SAMSUNG ELECTRONICS CO LTD124 citations99
US7195987B2Mar 27, 2007
Methods of forming CMOS integrated circuit devices and substrates having buried silicon germanium layers therein
SAMSUNG ELECTRONICS CO LTD26 citations92
US6914301B2Jul 5, 2005
CMOS integrated circuit devices and substrates having buried silicon germanium layers therein and methods of forming same
SAMSUNG ELECTRONICS CO LTD20 citations92
US5665631ASep 9, 1997
SOI substrate manufacturing method
SAMSUNG ELECTRONICS CO LTD31 citations89
US5746883AMay 5, 1998
Apparatus for bonding semiconductor wafers
SAMSUNG ELECTRONICS CO LTD4 citations59