Inventor

LETERTRE FABRICE

FR82 patents

⚠️ This page may combine multiple inventors who share the name “LETERTRE FABRICE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LETERTRE FABRICE

SOITEC SILICON ON INSULATOR

Methods for fabricating final substrates

Methods for fabricating a substrate

Method of fabricating substrates, in particular for optics, electronics or optoelectronics

Support-integrated donor wafers for repeated thin donor layer separation

Support-integrated donor wafers for repeated thin donor layer separation

Semiconductor substrates having useful and transfer layers

Semiconductor substrates having useful and transfer layers

Method of fabricating an epitaxially grown layer

Semiconductor substrates having useful and transfer layers

Semiconductor substrates having useful and transfer layers

Method of fabricating heteroepitaxial microstructures

Methods for fabricating a substrate

Substrate cutting device and method

Methods for forming an assembly for transfer of a useful layer

Methods for fabricating final substrates

Method of manufacturing a free-standing substrate made of monocrystalline semi-conductor material

Method of fabricating heteroepitaxial microstructures

Methods for making substrates and substrates formed therefrom

Method for recycling a substrate

Method of fabricating a mixed substrate

Methods for relaxation and transfer of strained layers and structures fabricated thereby

Methods for making substrates and substrates formed therefrom

Process for fabricating a structure for epitaxy without an exclusion zone

Fabrication of substrates with a useful layer of monocrystalline semiconductor material

Multilayer structure and fabrication thereof

Method of fabricating heteroepitaxial microstructures

Semiconductor substrates having useful and transfer layers

Multilayer structure and fabrication thereof

Optoelectronic substrate and methods of making same

Method for manufacturing a free-standing substrate made of monocrystalline semiconductor material

Methods for transferring a useful layer of silicon carbide to a receiving substrate

Methods for fabricating a germanium on insulator wafer

Methods for transferring a useful layer of silicon carbide to a receiving substrate

Methods for making substrates and substrates formed therefrom

Methods for forming an assembly for transfer of a useful layer

Fabrication of substrates with a useful layer of monocrystalline semiconductor material

Methods for preparing a semiconductor assembly

Device and method for cutting an assembly

Substrate assembly for stressed systems

Substrate for stressed systems and method of making same

COMMISSARIAT ENERGIE ATOMIQUE

Method for making a stacked comprising a thin film adhering to a target substrate

Multifunctional metallic bonding

Wafer and method of producing a substrate by transfer of a layer that includes foreign species

Manufacturing process for a stacked structure comprising a thin layer bonding to a target substrate

Multifunctional metallic bonding

ARENA CHANTAL

Process for fabricating a structure for epitaxy without an exclusion zone

LETERTRE FABRICE

Methods of fabricating semiconductor structures and devices using glass bonding layers, and semiconductor structures and devices formed by such methods

MORICEAU HUBERT

Manufacturing process for a stacked structure comprising a thin layer bonding to a target substrate

RAYSSAC OLIVIER

Substrate cutting device and method

BETHOUX JEAN-MARC

Heterostructure for electronic power components, optoelectronic or photovoltaic components