Inventor
BAO ZHONGPING
US8 patents
⚠️ This page may combine multiple inventors who share the name “BAO ZHONGPING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
QUALCOMM INC
5 patentsUS8963339B2Feb 24, 2015
Stacked multi-chip integrated circuit package
QUALCOMM INC59 citations96
US9263186B2Feb 16, 2016
DC/ AC dual function Power Delivery Network (PDN) decoupling capacitor
QUALCOMM INC38 citations92
US9406649B2Aug 2, 2016
Stacked multi-chip integrated circuit package
QUALCOMM INC3 citations72
US9379065B2Jun 28, 2016
Crack stopping structure in wafer level packaging (WLP)
QUALCOMM INC5 citations71
US8847391B2Sep 30, 2014
Non-circular under bump metallization (UBM) structure, orientation of non-circular UBM structure and trace orientation to inhibit peeling and/or cracking
QUALCOMM INC4 citations66