Inventor
LAI CHIA-HUNG
TW11 patents
⚠️ This page may combine multiple inventors who share the name “LAI CHIA-HUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
5 patentsUS6006764ADec 28, 1999
Method of stripping photoresist from Al bonding pads that prevents corrosion
TAIWAN SEMICONDUCTOR MFG73 citations95
US7015129B2Mar 21, 2006
Bond pad scheme for Cu process
TAIWAN SEMICONDUCTOR MFG7 citations73
US7160811B2Jan 9, 2007
Laminated silicate glass layer etch stop method for fabricating microelectronic product
TAIWAN SEMICONDUCTOR MFG5 citations62
US6844626B2Jan 18, 2005
Bond pad scheme for Cu process
TAIWAN SEMICONDUCTOR MFG3 citations62
US7056821B2Jun 6, 2006
Method for manufacturing dual damascene structure with a trench formed first
TAIWAN SEMICONDUCTOR MFG3 citations57
TAIWAN SEMICONDUCTOR MFG CO LTD
3 patentsUS11094579B2Aug 17, 2021
Method of forming shallow trench isolation structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US10699938B2Jun 30, 2020
Shallow trench isolation structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations49
US10871720B2Dec 22, 2020
Apparatus for supporting a semiconductor wafer and method of vibrating a semiconductor wafer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations35