Inventor
HIGASHIGUCHI KOHEI
JP5 patents
Patents
5 patentsUS10808103B2Oct 20, 2020
Resin composition, laminate including the resin composition, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device including the semiconductor wafer with resin composition layer
MITSUBISHI GAS CHEMICAL CO1 citations57
US11935803B2Mar 19, 2024
Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device
MITSUBISHI GAS CHEMICAL CO0 citations56
US11053382B2Jul 6, 2021
Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device
MITSUBISHI GAS CHEMICAL CO0 citations47
US11924979B2Mar 5, 2024
Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device
MITSUBISHI GAS CHEMICAL CO0 citations46
US12568848B2Mar 3, 2026
Film, laminate, semiconductor wafer with film layer, substrate for mounting a semiconductor with film layer, and semiconductor device
MITSUBISHI GAS CHEMICAL CO0 citations45