Inventor
LEI LAWRENCE C
US30 patents
⚠️ This page may combine multiple inventors who share the name “LEI LAWRENCE C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
29 patentsUS6718126B2Apr 6, 2004
Apparatus and method for vaporizing solid precursor for CVD or atomic layer deposition
APPLIED MATERIALS INC211 citations99
US5516367AMay 14, 1996
Chemical vapor deposition chamber with a purge guide
APPLIED MATERIALS INC397 citations99
US5213650AMay 25, 1993
Apparatus for removing deposits from backside and end edge of semiconductor wafer while preventing removal of materials from front surface of wafer
APPLIED MATERIALS INC530 citations99
US6589352B1Jul 8, 2003
Self aligning non contact shadow ring process kit
APPLIED MATERIALS INC566 citations98
US6364949B1Apr 2, 2002
300 mm CVD chamber design for metal-organic thin film deposition
APPLIED MATERIALS INC424 citations98
US6302964B1Oct 16, 2001
One-piece dual gas faceplate for a showerhead in a semiconductor wafer processing system
APPLIED MATERIALS INC986 citations98
US6086677AJul 11, 2000
Dual gas faceplate for a showerhead in a semiconductor wafer processing system
APPLIED MATERIALS INC1,102 citations98
US5556476ASep 17, 1996
Controlling edge deposition on semiconductor substrates
APPLIED MATERIALS INC134 citations98
US5556501ASep 17, 1996
Silicon scavenger in an inductively coupled RF plasma reactor
APPLIED MATERIALS INC396 citations98
US6866746B2Mar 15, 2005
Clamshell and small volume chamber with fixed substrate support
APPLIED MATERIALS INC130 citations97
US6932871B2Aug 23, 2005
Multi-station deposition apparatus and method
APPLIED MATERIALS INC78 citations96
US6729824B2May 4, 2004
Dual robot processing system
APPLIED MATERIALS INC59 citations96
US6375748B1Apr 23, 2002
Method and apparatus for preventing edge deposition
APPLIED MATERIALS INC293 citations96
US5075256ADec 24, 1991
Process for removing deposits from backside and end edge of semiconductor wafer while preventing removal of materials from front surface of wafer
APPLIED MATERIALS INC56 citations96
US5476548ADec 19, 1995
Reducing backside deposition in a substrate processing apparatus through the use of a shadow ring
APPLIED MATERIALS INC92 citations95
US6436192B2Aug 20, 2002
Apparatus for aligning a wafer
APPLIED MATERIALS INC18 citations93
US6063440AMay 16, 2000
Method for aligning a wafer
APPLIED MATERIALS INC22 citations93
US5468298ANov 21, 1995
Bottom purge manifold for CVD tungsten process
APPLIED MATERIALS INC47 citations92
US7112961B2Sep 26, 2006
Method and apparatus for dynamically measuring the thickness of an object
APPLIED MATERIALS INC18 citations91
US6223447B1May 1, 2001
Fastening device for a purge ring
APPLIED MATERIALS INC50 citations90
US6503331B1Jan 7, 2003
Tungsten chamber with stationary heater
APPLIED MATERIALS INC18 citations84
US8342119B2Jan 1, 2013
Self aligning non contact shadow ring process kit
APPLIED MATERIALS INC11 citations83
US7355394B2Apr 8, 2008
Apparatus and method of dynamically measuring thickness of a layer of a substrate
APPLIED MATERIALS INC9 citations80
US7547465B2Jun 16, 2009
Multi-station deposition apparatus and method
APPLIED MATERIALS INC4 citations72
US5421894AJun 6, 1995
Power loss recovery for wafer heater
APPLIED MATERIALS INC13 citations71
US9031685B2May 12, 2015
Atomic layer deposition apparatus
APPLIED MATERIALS INC1 citations63
US7923069B2Apr 12, 2011
Multi-station deposition apparatus and method
APPLIED MATERIALS INC2 citations61
US7777483B2Aug 17, 2010
Method and apparatus for measuring a thickness of a layer of a wafer
APPLIED MATERIALS INC3 citations61
US7794789B2Sep 14, 2010
Multi-station deposition apparatus and method
APPLIED MATERIALS INC0 citations51