Inventor
AKIYAMA DAISAKU
JP7 patents
Patents
7 patentsUS5532094AJul 2, 1996
Composition for treating copper or copper alloy surfaces
MEC CO LTD96 citations94
US5439783AAug 8, 1995
Composition for treating copper or copper alloys
MEC CO LTD20 citations90
US7285229B2Oct 23, 2007
Etchant and replenishment solution therefor, and etching method and method for producing wiring board using the same
MEC CO LTD10 citations77
US12157837B2Dec 3, 2024
Adhesive composition, method for producing surface-treated metal member, and method for producing metal-resin composite body
MEC CO LTD0 citations59
US12460303B2Nov 4, 2025
Etching agent and method for producing circuit board
MEC CO LTD0 citations51
US10801112B2Oct 13, 2020
Composition for forming coating, production method for surface-treated metal member, and production method for metal-resin composite
MEC CO LTD0 citations43
US10329453B2Jun 25, 2019
Film-forming composition, method for producing surface-treated metal member, and method for producing metal-resin composite
MEC CO LTD0 citations43