Inventor
NAKAGAWA TOSHIKO
JP10 patents
Patents
10 patentsUS5965036AOct 12, 1999
Microetching composition for copper or copper alloy
MEC CO LTD82 citations94
US5807493ASep 15, 1998
Microetching method for copper or copper alloy
MEC CO LTD59 citations94
US5532094AJul 2, 1996
Composition for treating copper or copper alloy surfaces
MEC CO LTD96 citations94
US5700389ADec 23, 1997
Etching solution for copper or copper alloy
MEC CO LTD43 citations91
US5496590AMar 5, 1996
Composition for treating copper and copper alloy surfaces and method for the surface treatment
MEC CO LTD32 citations89
US5885476AMar 23, 1999
Composition for microetching copper or copper alloy
MEC CO LTD23 citations86
US6106899AAug 22, 2000
Method for surface treatment of copper or copper alloys
MEC CO LTD17 citations80
US6733886B2May 11, 2004
Laminate and method of manufacturing the same
MEC CO LTD9 citations69
US7029761B2Apr 18, 2006
Bonding layer for bonding resin on copper surface
MEC CO LTD5 citations59
US7156904B2Jan 2, 2007
Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby
MEC CO LTD3 citations56