P

Inventor

REYNOLDS TRACY

US13 patents
⚠️ This page may combine multiple inventors who share the name “REYNOLDS TRACY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MICRON TECHNOLOGY INC

12 patents
US6246108B1Jun 12, 2001

Integrated circuit package including lead frame with electrically isolated alignment feature

MICRON TECHNOLOGY INC273 citations98
US6048744AApr 11, 2000

Integrated circuit package alignment feature

MICRON TECHNOLOGY INC275 citations98
US6836003B2Dec 28, 2004

Integrated circuit package alignment feature

MICRON TECHNOLOGY INC17 citations92
US6199743B1Mar 13, 2001

Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies

MICRON TECHNOLOGY INC37 citations91
US6991970B2Jan 31, 2006

Method and apparatus for circuit completion through the use of ball bonds or other connections during the formation of semiconductor device

MICRON TECHNOLOGY INC14 citations79
US6858453B1Feb 22, 2005

Integrated circuit package alignment feature

MICRON TECHNOLOGY INC11 citations73
US6454153B2Sep 24, 2002

Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies

MICRON TECHNOLOGY INC5 citations72
US6357275B1Mar 19, 2002

Apparatus and method for providing mechanically pre-formed conductive leads

MICRON TECHNOLOGY INC5 citations72
US6509205B2Jan 21, 2003

Apparatus and method for providing mechanically pre-formed conductive leads

MICRON TECHNOLOGY INC3 citations61
US6474532B2Nov 5, 2002

Apparatus for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies

MICRON TECHNOLOGY INC1 citations61
US6221748B1Apr 24, 2001

Apparatus and method for providing mechanically pre-formed conductive leads

MICRON TECHNOLOGY INC2 citations61
US6504257B1Jan 7, 2003

Apparatus and method for providing mechanically pre-formed conductive leads

MICRON TECHNOLOGY INC0 citations51

UNIV YALE

1 patent