Inventor
CHEN HOLMAN
TW4 patents
Patents
4 patentsUS7230323B2Jun 12, 2007
Ground-enhanced semiconductor package and lead frame for the same
SILICONWARE PRECISION INDUSTRIES CO LTD24 citations83
US7126229B2Oct 24, 2006
Wire-bonding method and semiconductor package using the same
SILICONWARE PRECISION INDUSTRIES CO LTD3 citations59
US6806565B2Oct 19, 2004
Lead-frame-based semiconductor package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations58
US7008826B2Mar 7, 2006
Lead-frame-based semiconductor package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations47