Inventor

HONG CHIN-YUAN

TW2 patents

Patents

2 patents

US6806565B2Oct 19, 2004

Lead-frame-based semiconductor package and fabrication method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD2 citations58

US7008826B2Mar 7, 2006

Lead-frame-based semiconductor package and fabrication method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations47