Inventor
HOLLINGSHEAD CURTIS
US5 patents
Patents
5 patentsUS6768209B1Jul 27, 2004
Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling microelectronic devices
MICRON TECHNOLOGY INC16 citations91
US6812064B2Nov 2, 2004
Ozone treatment of a ground semiconductor die to improve adhesive bonding to a substrate
MICRON TECHNOLOGY INC13 citations83
US7442578B2Oct 28, 2008
Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling micoelectronic devices
MICRON TECHNOLOGY INC4 citations72
US7094628B2Aug 22, 2006
Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling microelectronic devices
MICRON TECHNOLOGY INC2 citations61
US7170184B2Jan 30, 2007
Treatment of a ground semiconductor die to improve adhesive bonding to a substrate
MICRON TECHNOLOGY INC1 citations51