Inventor

NAKANO EIICHI

US72 patents

⚠️ This page may combine multiple inventors who share the name “NAKANO EIICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NAKANO EIICHI

MICRON TECHNOLOGY INC

Methods for fabricating 3D semiconductor device packages, resulting packages and systems incorporating such packages

Semiconductor devices having electrically and optically conductive vias, and associated systems and methods

Stacked semiconductor dies including inductors and associated methods

Redistribution layers with carbon-based conductive elements, methods of fabrication and related semiconductor device packages and systems

Semiconductor device packages and structures

Semiconductor assemblies including thermal circuits and methods of manufacturing the same

Semiconductor devices having electrically and optically conductive vias, and associated systems and methods

Semiconductor devices having electrically and optically conductive vias, and associated systems and methods

Stacked semiconductor dies including inductors and associated methods

Anisotropic conductive film with carbon-based conductive regions having void space and related semiconductor device assemblies and methods

Systems and methods for direct bonding in semiconductor die manufacturing

Anisotropic conductive film with carbon-based conductive regions and related semiconductor device assemblies and methods

Systems and methods for direct bonding in semiconductor die manufacturing

Semiconductor assemblies including thermal circuits and methods of manufacturing the same

Device packages including redistribution layers with carbon-based conductive elements, and methods of fabrication

Methods for fabricating 3D semiconductor device packages, resulting packages and systems incorporating such packages

Anisotropic conductive film with carbon-based conductive regions and related semiconductor assemblies, systems, and methods

Semiconductor device with flexible circuit for enabling non-destructive attaching and detaching of device to system board

Thermal management of GPU-HBM package by microchannel integrated substrate

Methods of forming microelectronic device assemblies and packages

Use of pre-channeled materials for anisotropic conductors

Thermal management of GPU-HBM package by microchannel integrated substrate

Microelectronic device assemblies and packages and related methods and systems

Semiconductor dice assemblies, packages and systems, and methods of operation

Use of pre-channeled materials for anisotropic conductors

Semiconductor dice assemblies, packages and systems, and methods of operation

SANDO IRON WORKS CO

Method and apparatus for the pretreatment of a cloth

Process for treating waste water containing polyvinyl alcohol

Method and apparatus for the pretreatment of a cloth

Method for bleaching cloth

Method for decolorization of waste water

Method for separation of polyvinyl alcohol from aqueous solutions thereof using peroxodisulfates

Method for desizing, scouring and bleaching textile product

Method for reforming cellulose fiber cloth

Method for continuous pretreatment of a cloth

KIKKOMAN CORP

Thermostable luciferase of firefly, thermostable luciferase gene of firefly, novel recombinant dna, and process for the preparation of thermostable luciferase of firefly

Mutant luciferase of a firefly

Mutant luciferase of a firefly, mutant luciferase genes, recombinant dnas containing the genes and a method of producing mutant luciferase

Purified luciferase from luciola cruciata

Luciferase gene and novel recombinant DNA as well as a method of producing luciferase

Purified luciferase from luciola lateralis

Luminescent tool, its auxiliary member and method of preserving bioluminescent composition used in the tool and the auxiliary member

NODA INST FOR SCIENTIFIC RES

Method for preparing a recombinant DNA phage

Method for preparation of a recombinant DNA phage

Novel bacteriophage and method for preparing same

Novel bacteriophage and method for breeding thereof

AJINOMOTO KK

Method of producing L-lysine

NEC CORP

Method of manufacturing semiconductor device

NODA INSTITUTUTE FOR SCIENT RE

DNA fragment containing a tannase gene, a recombinant plasmid, a process for producing tannase, and a promoter

LODESTAR LICENSING GROUP LLC

Device packages including redistribution layers with carbon-based conductive elements, and methods of fabrication