Inventor
EN HONJIN
JP7 patents
⚠️ This page may combine multiple inventors who share the name “EN HONJIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBIDEN CO LTD
6 patentsUS6591495B2Jul 15, 2003
Manufacturing method of a multilayered printed circuit board having an opening made by a laser, and using electroless and electrolytic plating
IBIDEN CO LTD102 citations98
US7415761B2Aug 26, 2008
Method of manufacturing multilayered circuit board
IBIDEN CO LTD35 citations95
US6613986B1Sep 2, 2003
Multilayer build-up wiring board
IBIDEN CO LTD42 citations95
US7832098B2Nov 16, 2010
Method of manufacturing a multilayered printed circuit board
IBIDEN CO LTD10 citations83
US7514779B2Apr 7, 2009
Multilayer build-up wiring board
IBIDEN CO LTD8 citations83
US7847318B2Dec 7, 2010
Multilayer build-up wiring board including a chip mount region
IBIDEN CO LTD6 citations73