Inventor

MIERA MICHELE L

US5 patents

⚠️ This page may combine multiple inventors who share the name “MIERA MICHELE L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FREESCALE SEMICONDUCTOR INC

2 patents

US7998852B2Aug 16, 2011

Methods for forming an RF device with trench under bond pad feature

FREESCALE SEMICONDUCTOR INC10 citations82

US9646897B2May 9, 2017

Die crack detector with integrated one-time programmable element

FREESCALE SEMICONDUCTOR INC3 citations70

REN XIAOWEI

2 patents

US9123804B2Sep 1, 2015

LDMOS minority carrier shunting

REN XIAOWEI1 citations48

US8772870B2Jul 8, 2014

LDMOS device with minority carrier shunt region

REN XIAOWEI1 citations48

JONES JEFFREY K

1 patent

US8134241B2Mar 13, 2012

Electronic elements and devices with trench under bond pad feature

JONES JEFFREY K0 citations50