Inventor
MUDAKATTE NIRANJAN SUNIL
US35 patents
Patents
35 patentsUS9807882B1Oct 31, 2017
Density-optimized module-level inductor ground structure
QUALCOMM INC21 citations94
US9893048B2Feb 13, 2018
Passive-on-glass (POG) device and method
QUALCOMM INC7 citations84
US10292269B1May 14, 2019
Inductor with metal-insulator-metal (MIM) capacitor
QUALCOMM INC9 citations83
US10290414B2May 14, 2019
Substrate comprising an embedded inductor and a thin film magnetic core
QUALCOMM INC6 citations73
US10163771B2Dec 25, 2018
Interposer device including at least one transistor and at least one through-substrate via
QUALCOMM INC4 citations73
US10103135B2Oct 16, 2018
Backside ground plane for integrated circuit
QUALCOMM INC3 citations73
US10069474B2Sep 4, 2018
Encapsulation of acoustic resonator devices
QUALCOMM INC4 citations73
US9966426B2May 8, 2018
Augmented capacitor structure for high quality (Q)-factor radio frequency (RF) applications
QUALCOMM INC4 citations73
US9959964B2May 1, 2018
Thin film magnet inductor structure for high quality (Q)-factor radio frequency (RF) applications
QUALCOMM INC6 citations73
US9875848B2Jan 23, 2018
MIM capacitor and method of making the same
QUALCOMM INC4 citations73
US9673275B2Jun 6, 2017
Isolated complementary metal-oxide semiconductor (CMOS) devices for radio-frequency (RF) circuits
QUALCOMM INC6 citations73
US10490621B1Nov 26, 2019
Close proximity tunable inductive elements
QUALCOMM INC3 citations72
US10044390B2Aug 7, 2018
Glass substrate including passive-on-glass device and semiconductor die
QUALCOMM INC2 citations71
US10582609B2Mar 3, 2020
Integration of through glass via (TGV) filter and acoustic filter
QUALCOMM INC4 citations70
US10171112B2Jan 1, 2019
RF multiplexer with integrated directional couplers
QUALCOMM INC2 citations70
US10944379B2Mar 9, 2021
Hybrid passive-on-glass (POG) acoustic filter
QUALCOMM INC0 citations63
US10498307B2Dec 3, 2019
Integrated device comprising a capacitor and inductor structure comprising a shared interconnect for a capacitor and an inductor
QUALCOMM INC1 citations63
US10693432B2Jun 23, 2020
Solenoid structure with conductive pillar technology
QUALCOMM INC1 citations62
US11024454B2Jun 1, 2021
High performance inductors
QUALCOMM INC0 citations52
US10607980B2Mar 31, 2020
Passive-on-glass (POG) device and method
QUALCOMM INC0 citations52
US10490348B2Nov 26, 2019
Two-dimensional structure to form an embedded three-dimensional structure
QUALCOMM INC0 citations52
US10332671B2Jun 25, 2019
Solenoid inductor
QUALCOMM INC0 citations52
US10187031B2Jan 22, 2019
Tunable matching network
QUALCOMM INC0 citations52
US10141908B2Nov 27, 2018
Multi-density MIM capacitor for improved passive on glass (POG) multiplexer performance
QUALCOMM INC0 citations52
US10103703B2Oct 16, 2018
Double-sided circuit
QUALCOMM INC0 citations52
US10103116B2Oct 16, 2018
Open-passivation ball grid array pads
QUALCOMM INC1 citations52
US10074625B2Sep 11, 2018
Wafer level package (WLP) ball support using cavity structure
QUALCOMM INC1 citations52
US10026546B2Jul 17, 2018
Apparatus with 3D wirewound inductor integrated within a substrate
QUALCOMM INC0 citations52
US9876513B2Jan 23, 2018
LC filter layer stacking by layer transfer to make 3D multiplexer structures
QUALCOMM INC1 citations52
US9780048B1Oct 3, 2017
Side-assembled passive devices
QUALCOMM INC1 citations52
US9343399B2May 17, 2016
Thick conductive stack plating process with fine critical dimension feature size for compact passive on glass technology
QUALCOMM INC0 citations52
US10038422B2Jul 31, 2018
Single-chip multi-frequency film bulk acoustic-wave resonators
QUALCOMM INC1 citations51
US10523253B2Dec 31, 2019
Glass substrate including passive-on-glass device and semiconductor die
QUALCOMM INC0 citations50
US9343403B2May 17, 2016
Stress mitigation structure for wafer warpage reduction
QUALCOMM INC0 citations42
US10614942B2Apr 7, 2020
Inductors formed with through glass vias
QUALCOMM INC0 citations41