Inventor

NOH BOIN

KR4 patents

⚠️ This page may combine multiple inventors who share the name “NOH BOIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

3 patents

US9601466B2Mar 21, 2017

NOH BOIN

1 patent

US9142498B2Sep 22, 2015

Semiconductor devices having stacked solder bumps with intervening metal layers to provide electrical interconnections

NOH BOIN6 citations65

NOH BOIN

SAMSUNG ELECTRONICS CO LTD

Semiconductor package and method of manufacturing the same

Semiconductor package

Semiconductor package

NOH BOIN

Semiconductor devices having stacked solder bumps with intervening metal layers to provide electrical interconnections