Inventor

PENG YU-CHIANG

TW3 patents

Patents

3 patents

US11967652B2Apr 23, 2024

Sensor package structure having solder mask frame

TONG HSING ELECTRONIC INDUSTRIES LTD1 citations71

US12224359B2Feb 11, 2025

Sensor package structure having solder mask frame

TONG HSING ELECTRONIC INDUSTRIES LTD0 citations60

US11984516B2May 14, 2024

Sensor package structure having ring-shaped solder mask frame

TONG HSING ELECTRONIC INDUSTRIES LTD0 citations60