Inventor

CHANG MEI

US226 patents

⚠️ This page may combine multiple inventors who share the name “CHANG MEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHANG MEI

APPLIED MATERIALS INC

Dual-direction chemical delivery system for ALD/CVD chambers

Methods of depositing metal films using metal oxyhalide precursors

Dual-direction chemical delivery system for ALD/CVD chambers

Dual-direction chemical delivery system for ALD/CVD chambers

Apparatus for hybrid chemical processing

Apparatus and method for hybrid chemical processing

Method and apparatus of generating PDMAT precursor

Copper interconnect barrier layer structure and formation method

Deposition of copper with increased adhesion

Apparatus for substrate processing with improved throughput and yield

Substrate support shield in wafer processing reactors

Chemical vapor deposition of a thin film onto a substrate

Passive shield for CVD wafer processing which provides frontside edge exclusion and prevents backside depositions

Thermally floating pedestal collar in a chemical vapor deposition chamber

Chemical vapor deposition chamber with a purge guide

Apparatus for removing deposits from backside and end edge of semiconductor wafer while preventing removal of materials from front surface of wafer

Process for CVD deposition of tungsten layer on semiconductor wafer

Inlet manifold and methods for increasing gas dissociation and for PECVD of dielectric films

Apparatus and method for providing uniform flow of gas

Deposition chambers with UV treatment and methods of use

Methods of thin film process

Methods and systems for forming at least one dielectric layer

Gas delivery apparatus for atomic layer deposition

Lid assembly for front end of line fabrication

Noble metal layer formation for copper film deposition

Apparatus and method for hybrid chemical processing

Method for front end of line fabrication

Ruthenium layer formation for copper film deposition

Integration of ALD tantalum nitride for copper metallization

Formation of composite tungsten films

Method for in-situ, post deposition surface passivation of a chemical vapor deposited film

Deposition of tungsten nitride by plasma enhanced chemical vapor deposition

Methods and apparatus for a cleaning process in a high temperature, corrosive, plasma environment

Removable pumping channel liners within a chemical vapor deposition chamber

Plasma processing apparatus

Clamping ring and susceptor therefor

Method for forming low resistance and low defect density tungsten contacts to silicon semiconductor wafer

Magnetic field-enhanced plasma etch reactor

Cleaning process for removal of deposits from the susceptor of a chemical vapor deposition apparatus

Process for selective deposition of tungsten on semiconductor wafer

Reactor chamber self-cleaning process

Magnetic field-enhanced plasma etch reactor

Methods for pre-cleaning conductive interconnect structures

Ruthenium as an underlayer for tungsten film deposition

Method for unreacted precursor conversion and effluent removal

Chemical vapor deposition hot-trap for unreacted precursor conversion and effluent removal

Construction of a tantalum nitride film on a semiconductor wafer

Chemical vapor deposition chamber

KAO CHIEN-TEH

Method for removing oxides

CHANG MEI

Methods for atomic layer etching