Inventor
BANG JUNGJE
KR19 patents
Patents
19 patentsUS11277949B2Mar 15, 2022
Electronic device comprising interposer surrounding circuit elements disposed on printed circuit board
SAMSUNG ELECTRONICS CO LTD7 citations84
US10798849B2Oct 6, 2020
Electronic device having heat collection/diffusion structure
SAMSUNG ELECTRONICS CO LTD12 citations84
US11047628B2Jun 29, 2021
Electronic device having heat collection/diffusion structure
SAMSUNG ELECTRONICS CO LTD5 citations83
US10709043B2Jul 7, 2020
Electronic device comprising interposer surrounding circuit elements disposed on printed circuit board
SAMSUNG ELECTRONICS CO LTD6 citations82
US9924616B2Mar 20, 2018
Shield can, electronic device, and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD9 citations81
US11555657B2Jan 17, 2023
Electronic device having heat collection/diffusion structure
SAMSUNG ELECTRONICS CO LTD3 citations72
US11304337B2Apr 12, 2022
Electronic device comprising heat transfer member having metal plate and heat transfer material coupled thereto
SAMSUNG ELECTRONICS CO LTD5 citations72
US11825639B2Nov 21, 2023
Electronic device comprising interposer surrounding circuit elements disposed on printed circuit board
SAMSUNG ELECTRONICS CO LTD1 citations71
US10757846B2Aug 25, 2020
Electronic device including shielding member connected to conductive plate covering opening of shield can
SAMSUNG ELECTRONICS CO LTD5 citations71
US9652049B2May 16, 2017
Electrical connector having an external switch
SAMSUNG ELECTRONICS CO LTD4 citations70
US11202364B2Dec 14, 2021
Electronic device comprising flexible printed circuit board having arranged thereon plurality of ground wiring surrounding signal wiring
SAMSUNG ELECTRONICS CO LTD1 citations62
US12274040B2Apr 8, 2025
Electronic device comprising interposer surrounding circuit elements disposed on printed circuit board
SAMSUNG ELECTRONICS CO LTD0 citations61
US11098959B2Aug 24, 2021
Electronic device having heat collection/diffusion structure
SAMSUNG ELECTRONICS CO LTD0 citations61
US12520431B2Jan 6, 2026
Electronic device comprising solder wall
SAMSUNG ELECTRONICS CO LTD0 citations58
US12144115B2Nov 12, 2024
Electronic device including thermosetting bonding sheet
SAMSUNG ELECTRONICS CO LTD0 citations57
US11832389B2Nov 28, 2023
Printed circuit module and electronic device including the same
SAMSUNG ELECTRONICS CO LTD1 citations57
US12142815B2Nov 12, 2024
Electronic device comprising antenna module
SAMSUNG ELECTRONICS CO LTD0 citations52
US12245374B2Mar 4, 2025
Electronic device comprising interposer
SAMSUNG ELECTRONICS CO LTD0 citations51
US11516950B2Nov 29, 2022
Electronic device comprising display module having stress neutralization layer between flexible substrate and conductive layer
SAMSUNG ELECTRONICS CO LTD0 citations50