Inventor

CHANG GENG-MING

TW2 patents

Patents

2 patents

US12438120B2Oct 7, 2025

Chip package structure with redistribution layer having bonding portion

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59

US11056459B2Jul 6, 2021

Chip package structure and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations59