Inventor
SANDA YASUYUKI
JP7 patents
Patents
7 patentsUS9892992B2Feb 13, 2018
Swaged heat sink and heat sink integrated power module
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US11152280B2Oct 19, 2021
Semiconductor device and method for manufacturing the same
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US10768127B2Sep 8, 2020
Thermal conductivity measurement apparatus and thermal conductivity measurement method
MITSUBISHI ELECTRIC CORP3 citations69
US12477704B2Nov 18, 2025
Power semiconductor device and method of manufacturing the same, and power conversion device
MITSUBISHI ELECTRIC CORP0 citations56
US11322430B2May 3, 2022
Semiconductor device and semiconductor module with a highest portion of a terminal lower than a highest portion of the mold sealing resin
MITSUBISHI ELECTRIC CORP0 citations56
US11049787B2Jun 29, 2021
Semiconductor device and method of manufacturing the same
MITSUBISHI ELECTRIC CORP0 citations48
US10775329B2Sep 15, 2020
Thermal conductivity measurement device and thermal conductivity measurement method
MITSUBISHI ELECTRIC CORP0 citations38