Inventor
SIKORSKI EDMUND M
US6 patents
⚠️ This page may combine multiple inventors who share the name “SIKORSKI EDMUND M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
5 patentsUS6518136B2Feb 11, 2003
Sacrificial polysilicon sidewall process and rapid thermal spike annealing for advance CMOS fabrication
IBM42 citations95
US7820552B2Oct 26, 2010
Advanced high-k gate stack patterning and structure containing a patterned high-k gate stack
IBM10 citations84
US6743686B2Jun 1, 2004
Sacrificial polysilicon sidewall process and rapid thermal spike annealing for advance CMOS fabrication
IBM8 citations73
US9711365B2Jul 18, 2017
Etch rate enhancement for a silicon etch process through etch chamber pretreatment
IBM3 citations70
US8928124B2Jan 6, 2015
High aspect ratio and reduced undercut trench etch process for a semiconductor substrate
IBM2 citations60