Inventor

WANG TUNG-CHUAN

TW6 patents

⚠️ This page may combine multiple inventors who share the name “WANG TUNG-CHUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ADVANCED CHIP ENG TECH INC

3 patents

US7655501B2Feb 2, 2010

Wafer level package with good CTE performance

ADVANCED CHIP ENG TECH INC50 citations93

US7525185B2Apr 28, 2009

Semiconductor device package having multi-chips with side-by-side configuration and method of the same

ADVANCED CHIP ENG TECH INC14 citations83

US7459729B2Dec 2, 2008

Semiconductor image device package with die receiving through-hole and method of the same

ADVANCED CHIP ENG TECH INC16 citations83

YOUNGTEK ELECTRONICS CORP

1 patent

US11145565B2Oct 12, 2021

Method of fabricating a chip package module with improve heat dissipation effect

YOUNGTEK ELECTRONICS CORP2 citations66

ADAVANCED CHIP ENGINEERING TEC

1 patent

US7498556B2Mar 3, 2009

Image sensor module having build-in package cavity and the method of the same

ADAVANCED CHIP ENGINEERING TEC6 citations56

HOLIEN TECH CO LTD

1 patent

US10115673B1Oct 30, 2018

Embedded substrate package structure

HOLIEN TECH CO LTD1 citations39