Inventor

JAO JUI-MENG

TW17 patents

⚠️ This page may combine multiple inventors who share the name “JAO JUI-MENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

JAO JUI-MENG

UNITED MICROELECTRONICS CORP

Method for forming a metal structure

On-chip test circuit for assessing chip integrity

Parasitic capacitance-preventing dummy solder bump structure and method of making the same

Flip chip package with reduced thermal stress

Chip and package structure

Crack stopping structure and method for fabricating the same

Semiconductor wafer

Fabrication of semiconductor integrated circuit chips

Semiconductor structure and fabricating method thereof

Metal structure

Die seal ring

SILICONWARE PRECISION INDUSTRIES CO LTD

Multi-chip integrated circuit package structure for central pad chip

Structure of solder bumps with improved coplanarity and method of forming solder bumps with improved coplanarity

Method of fabricating a ball grid array integrated circuit package having an encapsulating body

Method of fabricating solder bumps with high coplanarity for flip-chip application

Method of forming solder areas over a lead frame

SILICONWARE PREC IND

Heat-dissipating device for integrated circuit package