Inventor
OGUMA Keisuke
JP5 patents
⚠️ This page may combine multiple inventors who share the name “OGUMA Keisuke”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KANEKA CORP
3 patentsUS9826623B2Nov 21, 2017
Heat dissipating structure
KANEKA CORP3 citations68
US11993740B2May 28, 2024
Low dielectric resin composition, molded article, film, multilayer film and flexible printed wiring board
KANEKA CORP0 citations58
US10356946B2Jul 16, 2019
Heat dissipation structure
KANEKA CORP1 citations56