Inventor
NICKERSON ROBERT
US19 patents
⚠️ This page may combine multiple inventors who share the name “NICKERSON ROBERT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
14 patentsUS9159690B2Oct 13, 2015
Tall solders for through-mold interconnect
INTEL CORP42 citations91
US7375978B2May 20, 2008
Method and apparatus for trace shielding and routing on a substrate
INTEL CORP23 citations90
US7190068B2Mar 13, 2007
Bottom heat spreader
INTEL CORP19 citations90
US11430724B2Aug 30, 2022
Ultra-thin, hyper-density semiconductor packages
INTEL CORP5 citations83
US7250684B2Jul 31, 2007
Circular wire-bond pad, package made therewith, and method of assembling same
INTEL CORP14 citations82
US9666549B2May 30, 2017
Methods for solder for through-mold interconnect
INTEL CORP10 citations81
US10231338B2Mar 12, 2019
Methods of forming trenches in packages structures and structures formed thereby
INTEL CORP2 citations69
US12476174B2Nov 18, 2025
Ultra-thin, hyper-density semiconductor packages
INTEL CORP0 citations62
US12406914B2Sep 2, 2025
Ultra-thin, hyper-density semiconductor packages
INTEL CORP0 citations62
US7302756B2Dec 4, 2007
Bond finger on via substrate, process of making same, package made thereby, and method of assembling same
INTEL CORP2 citations60
US12557683B2Feb 17, 2026
Solder grid array for attachment of a die package
INTEL CORP0 citations54
US11462527B2Oct 4, 2022
Micro-trenching mold interface in a pop package
INTEL CORP0 citations53
US9177911B2Nov 3, 2015
Package substrates with multiple dice
INTEL CORP0 citations50
US7205649B2Apr 17, 2007
Ball grid array copper balancing
INTEL CORP1 citations50