Inventor
TABIERA Michael
PH4 patents
Patents
4 patentsUS9824979B2Nov 21, 2017
Electronic package having electromagnetic interference shielding and associated method
ST MICROELECTRONICS INC4 citations66
US11688715B2Jun 27, 2023
Semiconductor die with multiple contact pads electrically coupled to a lead of a lead frame
ST MICROELECTRONICS INC0 citations57
US11152326B2Oct 19, 2021
Semiconductor die with multiple contact pads electrically coupled to a lead of a lead frame
ST MICROELECTRONICS INC0 citations57
US11088087B2Aug 10, 2021
Micro module with a support structure
ST MICROELECTRONICS INC0 citations46