Inventor
LI GUANGXU
US11 patents
⚠️ This page may combine multiple inventors who share the name “LI GUANGXU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TEXAS INSTRUMENTS INC
8 patentsUS12278205B2Apr 15, 2025
Semiconductor device package with improved die pad and solder mask design
TEXAS INSTRUMENTS INC2 citations72
US11784113B2Oct 10, 2023
Multilayer package substrate with stress buffer
TEXAS INSTRUMENTS INC2 citations71
US12438072B2Oct 7, 2025
Multilayer package substrate with stress buffer
TEXAS INSTRUMENTS INC0 citations61
US12243835B2Mar 4, 2025
Package substrate with CTE matching barrier ring around microvias
TEXAS INSTRUMENTS INC0 citations60
US11270955B2Mar 8, 2022
Package substrate with CTE matching barrier ring around microvias
TEXAS INSTRUMENTS INC0 citations60
US12550741B2Feb 10, 2026
Protruded scribe feature delamination mitigation
TEXAS INSTRUMENTS INC0 citations51
US12381139B2Aug 5, 2025
Electronic device and multilevel package substrate with elevated trace features for solder and/or die confinement and method for fabricating the electronic device
TEXAS INSTRUMENTS INC0 citations50
US10748863B2Aug 18, 2020
Semiconductor devices having metal posts for stress relief at flatness discontinuities
TEXAS INSTRUMENTS INC0 citations49