P

Inventor

LING YUN

US38 patents
⚠️ This page may combine multiple inventors who share the name “LING YUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

16 patents
US6575774B2Jun 10, 2003

Power connector for high current, low inductance applications

INTEL CORP73 citations92
US7029307B1Apr 18, 2006

Systems and methods for an improved card-edge connector

INTEL CORP29 citations86
US9596749B2Mar 14, 2017

Circuit board having a signal layer with signal traces and a reference plane with an additional signal trace larger than the signal traces

INTEL CORP8 citations82
US6710266B2Mar 23, 2004

Add-in card edge-finger design/stackup to optimize connector performance

INTEL CORP17 citations79
US7316570B2Jan 8, 2008

High performance edge connector

INTEL CORP7 citations74
US9812804B2Nov 7, 2017

Pogo-pins for high speed signaling

INTEL CORP2 citations73
US7040934B2May 9, 2006

Add-in card to backplane connecting apparatus

INTEL CORP7 citations72
US9318850B2Apr 19, 2016

Shielding a connector to reduce interference

INTEL CORP4 citations71
US6700464B2Mar 2, 2004

Low cost high speed board-to-board coaxial connector design with co-planar waveguide for PCB launch

INTEL CORP11 citations71
US6914189B1Jul 5, 2005

Electronic card with edge connector to minimize wear

INTEL CORP7 citations66
US7033197B2Apr 25, 2006

Integrated add-in card retention mechanism

INTEL CORP5 citations57
US7909627B2Mar 22, 2011

Multi-axis retention mechanism

INTEL CORP4 citations54
US9755334B2Sep 5, 2017

Retention mechanism for shielded flex cable to improve EMI/RFI for high speed signaling

INTEL CORP1 citations51
US11153968B2Oct 19, 2021

Device, system and method to promote the integrity of signal communications

INTEL CORP0 citations48
US10658198B2May 19, 2020

Solder resist layer structures for terminating de-featured components and methods of making the same

INTEL CORP0 citations45
US10244632B2Mar 26, 2019

Solder resist layer structures for terminating de-featured components and methods of making the same

INTEL CORP0 citations45

LING YUN

2 patents

SHENZHEN ULIKE SMART ELECTRONICS CO LTD

2 patents

PRIMETALS TECHNOLOGIES GERMANY GMBH

2 patents

CISCO TECH INC

1 patent

WU YUZHANG

1 patent

WANG WEI

1 patent

GUO HUIYAN

1 patent

MORGAN CONSTRUCTION CO

1 patent

HANGZHOU JINMO TECH CO LTD

1 patent

LEDDIGE MICHAEL

1 patent

HANGZHOU ZHEDA DIXUN BIOLOGICAL GENE ENG CO LTD

1 patent

PETROCHINA CO LTD

1 patent

SHORE T MICHAEL

1 patent

HANGZHOU ULIKE TECH CO LTD

1 patent

HUANENG LANCANG RIVER HYDROPOWER INC

1 patent

HAN SEUNG

1 patent

ZSCALER INC

1 patent

HUBEI HUIDA HIGH TECH CO LTD

1 patent

SHANGHAI NUCLEAR ENG RES & DES

1 patent