Inventor

NI CHING-YU

TW22 patents

⚠️ This page may combine multiple inventors who share the name “NI CHING-YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NI CHING-YU

XINTEC INC

Electronic device package and method for forming the same

Chip package and fabrication method thereof

Chip package and manufacturing method thereof

Chip package and fabrication method thereof

Electronic device package and method for forming the same

Power MOSFET package

TSAI CHIA-LUN

Electronic device package and method for fabricating the same

Light emitting device package structure and fabricating method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

KORE SEMICONDUCTOR CO LTD

Fan-out packaging structure and method of making same

Semiconductor packaging structure and method of fabricating same

Biochip packaging structure

Package structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG

Semiconductor packages and methods of manufacturing thereof

Constraint stiffener design

Semiconductor packages and methods of manufacturing thereof

NI CHING-YU

Electronic device containing passive components and fabrication method thereof

Chip package and fabrication method thereof

CHIEN WEN-CHENG

Electronic device package and method for forming the same

HON HAI PREC IND CO LTD

Chip packaging structure

PERNG BAW-CHING

Power MOSFET package