Inventor
BROUILLETTE GUY PAUL
CA10 patents
Patents
10 patentsUS5775569AJul 7, 1998
Method for building interconnect structures by injection molded solder and structures built
IBM120 citations98
US6527158B1Mar 4, 2003
Method and apparatus for forming solder bumps
IBM60 citations95
US6149122ANov 21, 2000
Method for building interconnect structures by injection molded solder and structures built
IBM61 citations95
US6133633AOct 17, 2000
Method for building interconnect structures by injection molded solder and structures built
IBM40 citations95
US6056191AMay 2, 2000
Method and apparatus for forming solder bumps
IBM83 citations95
US6003757ADec 21, 1999
Apparatus for transferring solder bumps and method of using
IBM81 citations93
US6394334B1May 28, 2002
Method and apparatus for forming solder bumps
IBM24 citations92
US5897336AApr 27, 1999
Direct chip attach for low alpha emission interconnect system
IBM42 citations92
US6340630B1Jan 22, 2002
Method for making interconnect for low temperature chip attachment
IBM28 citations91
US6127735AOct 3, 2000
Interconnect for low temperature chip attachment
IBM41 citations91