Inventor
KWAG GYU-HWAN
KR14 patents
Patents
14 patentsUS6503365B1Jan 7, 2003
Multi-chamber system having compact installation set-up for an etching facility for semiconductor device manufacturing
SAMSUNG ELECTRONICS CO LTD569 citations98
US6402849B2Jun 11, 2002
Process tube having slit type process gas injection portion and hole type waste gas exhaust portion, and apparatus for fabricating semiconductor device
SAMSUNG ELECTRONICS CO LTD105 citations95
US6232228B1May 15, 2001
Method of manufacturing semiconductor devices, etching composition for manufacturing semiconductor devices, and semiconductor devices made using the method
SAMSUNG ELECTRONICS CO LTD77 citations95
US5900163AMay 4, 1999
Methods for performing plasma etching operations on microelectronic structures
SAMSUNG ELECTRONICS CO LTD192 citations95
US6930050B2Aug 16, 2005
Multi-chamber system having compact installation set-up for an etching facility for semiconductor device manufacturing
SAMSUNG ELECTRONICS CO LTD19 citations92
US6197150B1Mar 6, 2001
Apparatus for wafer treatment for the manufacture of semiconductor devices
SAMSUNG ELECTRONICS CO LTD44 citations92
US6436809B1Aug 20, 2002
Method of manufacturing semiconductor devices, etching compositions for manufacturing semiconductor devices, and semiconductor devices made using this method
SAMSUNG ELECTRONICS CO LTD19 citations91
US6235147B1May 22, 2001
Wet-etching facility for manufacturing semiconductor devices
SAMSUNG ELECTRONICS CO LTD40 citations91
US6200414B1Mar 13, 2001
Circulation system for supplying chemical for manufacturing semiconductor devices and circulating method thereof
SAMSUNG ELECTRONICS CO LTD49 citations91
US6140233AOct 31, 2000
Method of manufacturing semiconductor devices, etching compositions for manufacturing semiconductor devices, and semiconductor devices thereby
SAMSUNG ELECTRONICS CO LTD32 citations91
US6113754ASep 5, 2000
Sputtering apparatus having a target backing plate equipped with a cooling line and sputtering method using the same
SAMSUNG ELECTRONICS CO LTD35 citations89
US6460269B2Oct 8, 2002
Wafer dryer comprising revolving spray nozzle and method for drying wafers using the same
SAMSUNG ELECTRONICS CO LTD19 citations82
US6732750B2May 11, 2004
Semiconductor wafer cleaning apparatus and method of using the same
SAMSUNG ELECTRONICS CO LTD8 citations72
US7776226B2Aug 17, 2010
Multi-chamber system having compact installation set-up for an etching facility for semiconductor device manufacturing
SAMSUNG ELECTRONICS CO LTD1 citations51