Inventor

HUANG TSUNG-HSIEN

CN64 patents

⚠️ This page may combine multiple inventors who share the name “HUANG TSUNG-HSIEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HUANG TSUNG-HSIEN

HUANG TSUNG-HSIEN

Cooler module

Heat dissipating module

Combined heat exchanger base and embedded heat pipes

Heat sink assembly

Heat pipe assembly

Heat pipe mounting method

Non-base block heat sink

Connection structure of LED lamp holder and heat radiation fins

Heat sink with fins having angled foot portion

LED projector lamp with improved structure of radiation fins

Cooler module without base panel

Heat plate type cooler module

Heat sink module

Cooler module

Cooler module

Heat sink assembly

Aluminum pipe and heat pipe package and its packaging method

Heat transfer plate and heat pipe mounting structure and method

Heat sink module

Heat sink module with fins having Z shaped foot portions

Combination heat sink assembly

Lamp holder of LED projection lamp

LED light bulb with a multidirectional distribution and novel heat dissipating structure

Heat sink and mounting bracket arrangement

HUANG TSUNG HSIEN

Liquid cooling radiator with impurities filtering

Heat sink

Heat sink

Radiator fan fixing buckle device and its assembly structure

Liquid cooling device with a heat-resisting structure

Liquid cooling radiator for liquid coolers

Liquid cooling radiator with air barrier space between bending partitions

Integrated liquid cooling heat dissipation device

Dual liquid pump liquid cooling radiator and liquid cooling heat dissipation device

Heat sink assembly

TAIWAN SEMICONDUCTOR MFG CO LTD

SRAM with tracking circuitry for reducing active power

Semiconductor device having an inter-layer via (ILV), and method of making same

Semiconductor device having an inter-layer via (ILV), and method of making same

SRAM with tracking circuitry for reducing active power

Memory device and method of operating the same

Read margin tracking in memory applications

Device having an inter-layer via (ILV), and method of making same

Semiconductor device having an inter-layer via (ILV), and method of making same

HUIZHOU HANXU HARDWARE PLASTIC TECH CO LTD

Liquid-cooling heat dissipation apparatus

Liquid-cooling radiator

Liquid-cooling pump and flow channel structure thereof

DONGGUAN HANXU HARDWARE PLASTIC TECH CO LTD

Liquid-cooling block and liquid-cooling block assembly and liquid-cooling heat dissipation device

Integrated liquid-cooling radiator

CHANG MENG-FAN

Control scheme for 3D memory IC

BKS TEC CORP

Cable assembly and cable indication system

HAN XU HARDWARE PLASTIC TECH CO LTD

High-efficiency water-cooled heat dissipation device