Inventor
GREBET JEAN-MICHEL
SG4 patents
Patents
4 patentsUS9997554B2Jun 12, 2018
Chip scale package camera module with glass interposer having lateral conductive traces between a first and second glass layer and method for making the same
ST MICROELECTRONICS PTE LTD3 citations68
US10854651B2Dec 1, 2020
Image sensing device with cap and related methods
ST MICROELECTRONICS PTE LTD0 citations47
US10403661B2Sep 3, 2019
Image sensing device with cap and related methods
ST MICROELECTRONICS PTE LTD0 citations47
US9691801B2Jun 27, 2017
Image sensing device with cap and related methods
ST MICROELECTRONICS PTE LTD0 citations47