Inventor

AYGUN KEMAL

US103 patents

⚠️ This page may combine multiple inventors who share the name “AYGUN KEMAL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

AYGUN KEMAL

INTEL CORP

Ground via clustering for crosstalk mitigation

Shielded socket housing

Input/output package architectures, and methods of using same

Power delivery for embedded bridge die utilizing trench structures

Power delivery for embedded bridge die utilizing trench structures

Semiconductor package with through bridge die connections

Power delivery for embedded bridge die utilizing trench structures

Chip-to-chip interconnect with embedded electro-optical bridge structures

Helically insulated twinax cable systems and methods

Non-uniform substrate stackup

Interconnect routing configurations and associated techniques

Ground via clustering for crosstalk mitigation

Inorganic interposer for multi-chip packaging

Multimode signaling on decoupled input/output and power channels

Multimode signaling on decoupled input/output and power channels

Power delivery for embedded bridge die utilizing trench structures

Ground via clustering for crosstalk mitigation

Power delivery for embedded bridge die utilizing trench structures

Slow wave structure for millimeter wave antennas

Package substrates with magnetic build-up layers

Chip-to-chip interconnect with embedded electro-optical bridge structures

Interposer structures, semiconductor assembly and methods for forming interposer structures

Ground via clustering for crosstalk mitigation

Selective ground flood around reduced land pad on package base layer to enable high speed land grid array (LGA) socket

Rlink—die to die channel interconnect configurations to improve signaling

Method of forming an interference shield on a substrate

Coupled vias for channel cross-talk reduction

Horizontal pitch translation using embedded bridge dies

Conductive coating for a microelectronics package

Socket contact techniques and configurations

Ground via clustering for crosstalk mitigation

Die interconnect structures having bump field and ground plane

Ground via clustering for crosstalk mitigation

Package substrates with magnetic build-up layers

High density interconnect structures configured for manufacturing and performance

Ground via clustering for crosstalk mitigation

Enabling long interconnect bridges

Package substrates with magnetic build-up layers

Die interconnect structures and methods

Interconnect routing configurations and associated techniques

Non-uniform substrate stackup

QIAN ZHIGUO

X-line routing for dense multi-chip-package interconnects

X-line routing for dense multi-chip-package interconnects

GANESAN SANKA

Input/output package architectures

Flex cable and method for making the same

ZHANG ZHICHAO

Crosstalk polarity reversal and cancellation through substrate material tuning

Mechanism for facilitating dynamic cancellation of signal crosstalk in differential input/output channels

BRAUNISCH HENNING

Multimode signaling on decoupled input/output and power channels

SHIN JAEMIN

Package embedded equalizer

ALTUNYURT NEVIN

Mitigation of far-end crosstalk induced by routing and out-of-plane interconnects