Inventor

QIAN ZHIGUO

US75 patents

⚠️ This page may combine multiple inventors who share the name “QIAN ZHIGUO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

QIAN ZHIGUO

INTEL CORP

Bridge interconnect with air gap in package assembly

Ground via clustering for crosstalk mitigation

Power delivery for embedded bridge die utilizing trench structures

Power delivery for embedded bridge die utilizing trench structures

Semiconductor package with through bridge die connections

Power delivery for embedded bridge die utilizing trench structures

High density package interconnects

Non-uniform substrate stackup

Interconnect routing configurations and associated techniques

Ground via clustering for crosstalk mitigation

Inorganic interposer for multi-chip packaging

Microelectronic assemblies with inductors in direct bonding regions

Power delivery for embedded bridge die utilizing trench structures

Microelectronic assemblies

Ground via clustering for crosstalk mitigation

Power delivery for embedded bridge die utilizing trench structures

Microelectronic assemblies having magnetic core inductors

Integrated circuit package with test circuitry for testing a channel between dies

Package substrates with magnetic build-up layers

High density package interconnects

Interposer structures, semiconductor assembly and methods for forming interposer structures

Ground via clustering for crosstalk mitigation

High density package interconnects

Coreless package architecture for multi-chip opto-electronics

Rlink—die to die channel interconnect configurations to improve signaling

Coupled vias for channel cross-talk reduction

Horizontal pitch translation using embedded bridge dies

Trace modulations in connectors for integrated-circuit packages

Side mounted interconnect bridges

Ground via clustering for crosstalk mitigation

Die interconnect structures having bump field and ground plane

Ground via clustering for crosstalk mitigation

Package substrates with magnetic build-up layers

High density interconnect structures configured for manufacturing and performance

Ground via clustering for crosstalk mitigation

Enabling long interconnect bridges

Package substrates with magnetic build-up layers

Die interconnect structures and methods

Interconnect routing configurations and associated techniques

Bridge interconnect with air gap in package assembly

Non-uniform substrate stackup

Power delivery for embedded bridge die utilizing trench structures

Glass substrates having signal shielding for use with semiconductor packages and related methods

Dielectric-filled trench isolation of vias

Minimization of insertion loss variation in through-silicon vias (TSVs)

QIAN ZHIGUO

X-line routing for dense multi-chip-package interconnects

X-line routing for dense multi-chip-package interconnects

CHIU CHIA-PIN

Bridge interconnect with air gap in package assembly

GANESAN SANKA

High density package interconnects

SONG HONGJIANG

Smart impedance matching for high-speed I/O