Inventor

TAKAI KEIJI

JP7 patents

⚠️ This page may combine multiple inventors who share the name “TAKAI KEIJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MITSUI HIGH TEC

4 patents

US5717252AFeb 10, 1998

Solder-ball connected semiconductor device with a recessed chip mounting area

MITSUI HIGH TEC159 citations98

US5661086AAug 26, 1997

Process for manufacturing a plurality of strip lead frame semiconductor devices

MITSUI HIGH TEC126 citations95

US5614443AMar 25, 1997

Method of producing a frame made of connected semiconductor die mounting substrates

MITSUI HIGH TEC18 citations81

US8003444B2Aug 23, 2011

Semiconductor device and manufacturing method thereof

MITSUI HIGH TEC4 citations56

MITSUBISHI ELECTRIC CORP

1 patent

US6659385B2Dec 9, 2003

Wire-winding machine and a wire-winding method for making windings of a rotary electromechanical device

MITSUBISHI ELECTRIC CORP20 citations88

FUJISAWA PHARMACEUTICAL CO

1 patent

US4477447AOct 16, 1984

7-Acylaminocephalosporanic acid derivatives

FUJISAWA PHARMACEUTICAL CO17 citations82

TAKAI KEIJI

1 patent

US8258608B2Sep 4, 2012

Lead frame and intermediate product of semiconductor device

TAKAI KEIJI2 citations55