Inventor
YANG CHAO-HSIANG
TW26 patents
⚠️ This page may combine multiple inventors who share the name “YANG CHAO-HSIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
13 patentsUS10741537B2Aug 11, 2020
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD36 citations97
US10175294B2Jan 8, 2019
Testing of semiconductor chips with microbumps
TAIWAN SEMICONDUCTOR MFG CO LTD14 citations94
US9618572B2Apr 11, 2017
Testing of semiconductor chips with microbumps
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations93
US11169207B2Nov 9, 2021
Testing of semiconductor chips with microbumps
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations84
US10663512B2May 26, 2020
Testing of semiconductor chips with microbumps
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US10483174B1Nov 19, 2019
Integrated circuit component and package structure having the same
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US11335672B2May 17, 2022
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US12469753B2Nov 11, 2025
Integrated circuit component and package structure having the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11869819B2Jan 9, 2024
Integrated circuit component and package structure having the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11450579B2Sep 20, 2022
Integrated circuit component and package structure having the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US10957610B2Mar 23, 2021
Integrated circuit component and package structure having the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12322742B2Jun 3, 2025
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11855066B2Dec 26, 2023
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
TAIWAN SEMICONDUCTOR MFG
9 patentsUS9372206B2Jun 21, 2016
Testing of semiconductor chips with microbumps
TAIWAN SEMICONDUCTOR MFG1,778 citations99
US9116203B2Aug 25, 2015
Testing of semiconductor chips with microbumps
TAIWAN SEMICONDUCTOR MFG13 citations93
US7456507B2Nov 25, 2008
Die seal structure for reducing stress induced during die saw process
TAIWAN SEMICONDUCTOR MFG32 citations92
US7009222B2Mar 7, 2006
Protective metal structure and method to protect low-K dielectric layer during fuse blow process
TAIWAN SEMICONDUCTOR MFG28 citations92
US6835642B2Dec 28, 2004
Method of forming a metal fuse on semiconductor devices
TAIWAN SEMICONDUCTOR MFG32 citations92
US6867441B1Mar 15, 2005
Metal fuse structure for saving layout area
TAIWAN SEMICONDUCTOR MFG48 citations90
US7397106B2Jul 8, 2008
Laser fuse with efficient heat dissipation
TAIWAN SEMICONDUCTOR MFG9 citations84
US6639420B1Oct 28, 2003
Common probe card for flip-chip devices
TAIWAN SEMICONDUCTOR MFG17 citations81
US8049323B2Nov 1, 2011
Chip holder with wafer level redistribution layer
TAIWAN SEMICONDUCTOR MFG2 citations62