Inventor
HONG CHENG-YI
TW10 patents
⚠️ This page may combine multiple inventors who share the name “HONG CHENG-YI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
9 patentsUS10741537B2Aug 11, 2020
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD36 citations97
US9502323B2Nov 22, 2016
Method of forming encapsulated semiconductor device package
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US11335672B2May 17, 2022
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10714463B2Jul 14, 2020
Method of forming semicondcutor device package
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10504880B2Dec 10, 2019
Method of forming semicondcutor device package
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10276551B2Apr 30, 2019
Semiconductor device package and method of forming semiconductor device package
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US12322742B2Jun 3, 2025
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11855066B2Dec 26, 2023
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11508710B2Nov 22, 2022
Method of forming semiconductor device package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62