Inventor
LIN CHEN-HUA
TW45 patents
⚠️ This page may combine multiple inventors who share the name “LIN CHEN-HUA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
29 patentsUS10741537B2Aug 11, 2020
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD36 citations97
US10269586B2Apr 23, 2019
Package structure and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD43 citations93
US11626343B2Apr 11, 2023
Semiconductor device with enhanced thermal dissipation and method for making the same
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations85
US11088037B2Aug 10, 2021
Semiconductor device having probe pads and seal ring
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations83
US11804433B2Oct 31, 2023
Semiconductor package structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11769698B2Sep 26, 2023
Method of testing semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11335672B2May 17, 2022
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10937858B2Mar 2, 2021
Method for manufacturing semiconductor and structure thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10347548B2Jul 9, 2019
Integrated circuit package structure and testing method using the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US12322742B2Jun 3, 2025
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12243788B2Mar 4, 2025
Method of testing semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12183655B2Dec 31, 2024
Semiconductor device with enhanced thermal dissipation and method for making the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12027433B2Jul 2, 2024
Semiconductor package and method for making the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11993512B2May 28, 2024
Dual micro-electro mechanical system and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11855066B2Dec 26, 2023
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11776919B2Oct 3, 2023
Semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11721597B2Aug 8, 2023
Semiconductor device and manufacturing method of the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11482461B2Oct 25, 2022
Semiconductor package and method for making the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11450626B2Sep 20, 2022
Semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11274037B2Mar 15, 2022
Dual micro-electro mechanical system and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10937772B2Mar 2, 2021
Semiconductor package and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11908884B2Feb 20, 2024
Inductive device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11854913B2Dec 26, 2023
Method for detecting defects in semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11322576B2May 3, 2022
Inductive device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11837526B2Dec 5, 2023
Semiconductor package structure and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10629673B2Apr 21, 2020
Method for manufacturing semiconductor and structure thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9786567B2Oct 10, 2017
Chip-on-wafer process control monitoring for chip-on-wafer-on-substrate packages
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9581638B2Feb 28, 2017
Chip-on-wafer process control monitoring for chip-on-wafer-on-substrate packages
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10699977B2Jun 30, 2020
Method of detecting delamination in an integrated circuit package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
NANODYNAMICS INC
6 patentsUS6701593B2Mar 9, 2004
Process for producing inkjet printhead
NANODYNAMICS INC18 citations83
US6682177B2Jan 27, 2004
Ink supply structure for inkjet printhead
NANODYNAMICS INC11 citations72
US6857186B2Feb 22, 2005
Method of manufacturing a piezoelectric print-head
NANODYNAMICS INC8 citations71
US6702429B2Mar 9, 2004
Ink chamber structure for an inkjet printhead
NANODYNAMICS INC5 citations63
US6966634B2Nov 22, 2005
Ink supply structure for inkjet printhead
NANODYNAMICS INC2 citations61
US6592210B2Jul 15, 2003
Piezoelectric print-head and method of manufacture
NANODYNAMICS INC3 citations60
WISERTEK INTERNAT CORP
6 patentsUS6322182B1Nov 27, 2001
Method and apparatus of identifying ink stored in an ink-jet cartridge
WISERTEK INTERNAT CORP18 citations81
US6383335B1May 7, 2002
Heat bonding apparatus for manufacturing an ink-jet printhead
WISERTEK INTERNAT CORP11 citations73
US6364455B1Apr 2, 2002
Printhead of ink jet printing apparatus and manufacturing method therefor
WISERTEK INTERNAT CORP10 citations73
US6345885B1Feb 12, 2002
Ink-jet printhead and manufacturing process
WISERTEK INTERNAT CORP8 citations72
US6302526B1Oct 16, 2001
Electrode type print head for printing apparatus and method of manufacturing the same
WISERTEK INTERNAT CORP14 citations69
US6406835B1Jun 18, 2002
Method for manufacturing a printhead of ink jet printing apparatus
WISERTEK INTERNAT CORP2 citations60