Inventor
BENSON PETE A
US6 patents
Patents
6 patentsUS7498675B2Mar 3, 2009
Semiconductor component having plate, stacked dice and conductive vias
MICRON TECHNOLOGY INC292 citations99
US7060526B2Jun 13, 2006
Wafer level methods for fabricating multi-dice chip scale semiconductor components
MICRON TECHNOLOGY INC96 citations99
US6841883B1Jan 11, 2005
Multi-dice chip scale semiconductor components and wafer level methods of fabrication
MICRON TECHNOLOGY INC659 citations99
US7459393B2Dec 2, 2008
Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts
MICRON TECHNOLOGY INC58 citations98
US6998717B2Feb 14, 2006
Multi-dice chip scale semiconductor components
MICRON TECHNOLOGY INC64 citations98
US7224051B2May 29, 2007
Semiconductor component having plate and stacked dice
MICRON TECHNOLOGY INC34 citations96