Inventor
SU JUNXING
CN13 patents
⚠️ This page may combine multiple inventors who share the name “SU JUNXING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
WUHAN CHOICE TECH CO LTD
9 patentsUS11767450B2Sep 26, 2023
Adhesive, die attach film and preparation method therefor
WUHAN CHOICE TECH CO LTD0 citations60
US12252613B1Mar 18, 2025
Packaging film and preparation method thereof, and filter chip packaging method
WUHAN CHOICE TECH CO LTD0 citations59
US12024591B2Jul 2, 2024
Modification method of polyphenylene ether resin, laminated film composite, laminated film, and substrate
WUHAN CHOICE TECH CO LTD0 citations59
US11978686B2May 7, 2024
Chip protective film and method for manufacturing same, and chip
WUHAN CHOICE TECH CO LTD0 citations59
US11879076B1Jan 23, 2024
Composition, adhesive film and chip packaging structure
WUHAN CHOICE TECH CO LTD0 citations59
US11804463B2Oct 31, 2023
Underfill for chip packaging and chip packaging structure
WUHAN CHOICE TECH CO LTD0 citations59
US12098230B2Sep 24, 2024
Build-up film with low dielectric loss, preparation method therefor and circuit substrate structure
WUHAN CHOICE TECH CO LTD0 citations49
US11286386B1Mar 29, 2022
Circuit build-up film for wafer-level packaging, and fabrication method and use thereof
WUHAN CHOICE TECH CO LTD0 citations47
US12575373B2Mar 10, 2026
Wafer thinning tape and preparation method thereof, and wafer grinding method
WUHAN CHOICE TECH CO LTD0 citations44
HUBEI CHOICE TECH CO LTD
3 patentsUS12209171B2Jan 28, 2025
Liquid epoxy molding compound and preparation method thereof
HUBEI CHOICE TECH CO LTD0 citations57
US12037488B1Jul 16, 2024
Liquid molding compound and preparation method thereof
HUBEI CHOICE TECH CO LTD1 citations57
US11643499B2May 9, 2023
Liquid molding compound for protecting five edges of semiconductor chip and preparation method thereof
HUBEI CHOICE TECH CO LTD0 citations47