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Inventor

LI CHING I

TW48 patents
⚠️ This page may combine multiple inventors who share the name “LI CHING I”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

26 patents
US11869761B2Jan 9, 2024

Back-side deep trench isolation structure for image sensor

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations74
US11784204B2Oct 10, 2023

Enhanced trench isolation structure

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations74
US11916022B2Feb 27, 2024

Photolithography alignment process for bonded wafers

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US11721774B2Aug 8, 2023

Full well capacity for image sensor

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations71
US11817469B2Nov 14, 2023

Light absorbing layer to enhance P-type diffusion for DTI in image sensors

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations67
US12581762B2Mar 17, 2026

Enhanced trench isolation structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12557391B2Feb 17, 2026

Method for forming semiconductor-on-insulator (SOI) substrate and recycle substrate

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12557610B2Feb 17, 2026

Multilayer isolation structure for high voltage silicon-on-insulator device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12426390B2Sep 23, 2025

Passivation for a vertical transfer gate in a pixel sensor

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12408448B2Sep 2, 2025

Deep trench isolation structure and methods for fabrication thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12364046B2Jul 15, 2025

Photodiode structure for image sensor

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12349492B2Jul 1, 2025

Photodiode structure for image sensor

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12328886B2Jun 10, 2025

Metal-insulator-metal capacitor and methods of manufacturing

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12218184B2Feb 4, 2025

Semiconductor structure and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12002813B2Jun 4, 2024

Method for forming semiconductor-on-insulator (SOI) substrate by cleaving a multilayer structure along voids to separate a substrate

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11682578B2Jun 20, 2023

Multilayer isolation structure for high voltage silicon-on-insulator device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12500206B2Dec 16, 2025

Mechanical wafer alignment detection for bonding process

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11688717B2Jun 27, 2023

Mechanical wafer alignment detection for bonding process

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12230585B2Feb 18, 2025

Photolithography alignment process for bonded wafers

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12125665B2Oct 22, 2024

Ion implantation system

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11362038B2Jun 14, 2022

Photolithography alignment process for bonded wafers

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12484327B2Nov 25, 2025

Pre-cleaning for a deep trench isolation structure in a pixel sensor

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US12074186B2Aug 27, 2024

Isolation epitaxial bi-layer for backside deep trench isolation structure in an image sensor

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12439709B2Oct 7, 2025

Image sensor with diffusion barrier structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12532728B2Jan 20, 2026

Backside leakage prevention

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US12389710B2Aug 12, 2025

Full well capacity for image sensor

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50

UNITED MICROELECTRONICS CORP

11 patents

ADVANCED ION BEAM TECH INC

3 patents

YANG CHAN-LON

3 patents

SINHA ASHWINI K

1 patent

HSIAO TSAI-FU

1 patent

LIAO CHIN-I

1 patent

TSAI CHEN-HUA

1 patent

HUANG PO-CHENG

1 patent