Inventor

YU DAQUAN

CN4 patents

⚠️ This page may combine multiple inventors who share the name “YU DAQUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NAT CT FOR ADVANCED PACKAGING

2 patents

US9368376B2Jun 14, 2016

Mechanical debonding method and system

NAT CT FOR ADVANCED PACKAGING2 citations58

US9293368B2Mar 22, 2016

Method for removing electroplated metal facets and reusing a barrier layer without chemical mechanical polishing

NAT CT FOR ADVANCED PACKAGING0 citations45

HUATIAN TECH KUNSHAN ELECT CO LTD

1 patent

US10559525B2Feb 11, 2020

Embedded silicon substrate fan-out type 3D packaging structure

HUATIAN TECH KUNSHAN ELECT CO LTD9 citations74

XIAMEN SKY SEMICONDUCTOR TECH CO LTD

1 patent

US12014965B2Jun 18, 2024

Three-dimensional packaging structure and method for fan-out of bonding wall of device

XIAMEN SKY SEMICONDUCTOR TECH CO LTD0 citations38