P

Inventor

HUANG HENG-CHI

TW10 patents
⚠️ This page may combine multiple inventors who share the name “HUANG HENG-CHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

4 patents
US10170429B2Jan 1, 2019

Method for forming package structure including intermetallic compound

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations70
US11984419B2May 14, 2024

Package structure with a barrier layer

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US11469203B2Oct 11, 2022

Method for forming package structure with a barrier layer

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US10811377B2Oct 20, 2020

Package structure with a barrier layer and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations49

RICHTEK TECHNOLOGY CORP

4 patents
US12512395B2Dec 30, 2025

Chip packaging method and chip package unit

RICHTEK TECHNOLOGY CORP0 citations57
US12300565B2May 13, 2025

Chip package unit and chip packaging method

RICHTEK TECHNOLOGY CORP0 citations57
US11973010B2Apr 30, 2024

Chip packaging method and chip package unit

RICHTEK TECHNOLOGY CORP0 citations57
US11469162B2Oct 11, 2022

Plurality of vertical heat conduction elements attached to metal film

RICHTEK TECHNOLOGY CORP0 citations47

NAT UNIV TSING HUA

1 patent
US7947430B2May 24, 2011

Method of forming 3D micro structures with high aspect ratios

NAT UNIV TSING HUA12 citations82

UNIV TSINGHUA

1 patent
US7384729B2Jun 10, 2008

Method of manufacturing a LIGA mold by backside exposure

UNIV TSINGHUA4 citations60